The Effect Of Moisture On Copper-clad Grounding Rods

In humid environments, moisture in the soil and air can chemically react with the metal on the surface of copper clad ground rods, promoting oxidation. When the humidity and temperature of the environment where copper coated earthing rod is located change frequently, the surface oxidation rate will accelerate.

The outer metal layer of copper plated ground rod may form copper oxide after continuous exposure to moisture. This oxide layer locally alters the electrical conductivity. The surface is no longer pure metal, and the contact resistance with the soil may change, affecting the overall performance of the grounding system.

Regular inspections of the copperbond earth rod condition are crucial for the team responsible for maintaining and installing the grounding system. Attention should be paid to the connection between the deeply buried earth bonding rod sections and the surface. If obvious signs of oxidation or corrosion are found, a re-inspection of the grounding system should be considered to maintain the integrity of the overall structure.