Share The Development Status Of Insulation Piercing Connectors In The Communications Industry!
As the core physical interface of the optical communication network, the technological evolution of piercing cable connector directly reflects the upgrade trajectory of the communication industry. With the commercial use of 5G, the scale of data centers and the advancement of the "East Data West Computing" project, my country's piercing electrical connectors industry is experiencing a leapfrog development from following to running side by side. In this article, Xinpengbo Electronics will analyze the development status of piercing wire connector in the communication industry from three dimensions: technology iteration, market structure and future trends.
1. The technical development of wire piercing connector in the communication industry
Generational replacement:
1. The first generation FC/SC connector (1980s): ceramic ferrule structure, loss>0.5dB
2. The second generation LC/MU connector (2000s): miniaturized design, density increased by 300%
3. The third generation MPO/MTP connector (2020s): supports 400Gbps transmission, 12/24 core matrix layout
Key technological breakthroughs:
1. Ultra-precision machining: the tolerance of the end face spherical curvature radius is controlled at ±5μm
2. Anti-pollution design: self-cleaning ceramic ferrule makes the plug-in life exceed 1000 times
3. Intelligent diagnosis: integrated optical power monitoring chip (Huawei patent in 2023)
2. Market application status of optical fiber connectors in the communication industry
Industry distribution:
1. Telecommunication network Network accounts for 42% (5G fronthaul/midhaul scenarios)
2. Data center 35% (leaf-spine architecture cabling requirements)
3. Industrial Internet 23% (extreme environment adaptability requirements)
Regional pattern:
1. Yangtze River Delta (AVIC Optronics, etc.) accounts for 58% of production capacity
2. Pearl River Delta (Taichen Optics, etc.) accounts for 67% of exports
3. The annual growth rate of central and western regions (Fiberhome, etc.) exceeds 25%
3. Future development trend of optical fiber connectors in the communications industry
Technical direction:
1. Hollow core optical fiber connector (theoretical loss <0.01dB)
2. Photonic integration (silicon photonic chip direct connection solution)
3. AI operation and maintenance system (Huawei will release iConnector solution in 2024)
Challenges and opportunities:
1. Material bottleneck: 80% of zirconia ceramics rely on imports
2. Standard competition: IEC vs EIA/TIA international standard dominance
3. New infrastructure dividend: computing power network construction brings a market of hundreds of billions
Summary: This article systematically sorts out the breakthroughs of optical fiber connectors in transmission performance, density improvement and intelligence, and reveals its strategic value in new information infrastructure. It is recommended to pay attention to the two major technical breakthroughs of ceramic material localization and silicon photonic integration. These areas will determine whether my country can gain a leading edge in the next generation of optical connection technology.
