Process Characteristics Of Copper Clad Grounding Rod

1.threaded copperbond earth rod Manufacturing process features: The electroplating production process is adopted to achieve a high degree of integration of copper and steel. The surface copper layer is composed of 99.99% electrolytic copper molecules. It not only overcomes the disadvantages of the original battery reaction in the casing production process, but also solves the disadvantages of insufficient copper layer purity and yin and yang surfaces of the surface copper layer in the hot dip continuous casting process.

2. The copper-plated steel round wire has excellent anti-corrosion performance. The material shows that the copper layer is thicker and is 99.99% electrolytic copper molecules, with an average thickness of more than 0.25mm, so it has strong corrosion resistance and a service life of more than 50 years.

3. Copper-plated steel round wire. Better conductivity. Since the surface copper layer is composed of 99.99% electrolytic copper molecules, it has excellent conductivity and its own resistance is much lower than that of conventional materials.

4. Copper-plated steel round wire has a wider range of uses. This product is suitable for soil conditions with different humidity, temperature and pH values.

5. The copper-plated steel round wire is safe and quick to install. It has complete accessories. It uses a special connecting pipe or hot-melt solder to connect. The joint is firm and the installation is convenient, which greatly improves the construction efficiency.

6. The construction cost of the copper-plated steel round wire is reduced. Compared with the traditional use of pure copper materials for grounding, the cost is greatly reduced.