Insulation Piercing Connectors: Engineered Solutions With High Performance In A Small Package
Thermal management and material optimization
Challenge: High-density layout leads to heat dissipation difficulties.
Solution:
High thermal conductivity materials: Use LCP (liquid crystal polymer) or metal shell, the thermal conductivity is 5-10 times higher than that of ordinary plastics.
Heat dissipation structure: Increase the heat dissipation area through pin array or shell bumps.
Case: The electric vehicle battery management system uses copper substrate insulation piercing connector to achieve 100A current transmission in a 20mm×15mm space, while reducing the temperature rise by 15℃ through shell heat dissipation.
Key trade-offs and best practices
Trade-offs between performance and size: Miniaturization may sacrifice current carrying capacity, which needs to be compensated by parallel pins or optimized current-carrying structure.
Balance between standardization and customization: Prefer micro piercing connector (such as JST SH series) that meets IPC standards, and customize pin layout when necessary.
Simulation and test verification: Use 3D electromagnetic simulation tools (such as ANSYS HFSS) to predict signal integrity and avoid crosstalk problems caused by space compression.
Summary: ipc connector design under space constraints requires "system-level thinking" to integrate electrical, mechanical and thermal management requirements. Through miniaturized packaging, customized layout, cable optimization and intelligent structure innovation, high-density and high-reliability connections can be achieved in limited space. In the future, with the development of 3D printing and embedded component technology, ipc electrical connectors will further break through physical boundaries and provide new possibilities for device miniaturization.
